Embedded Software
Networking/Protocol, Management/High Availability (HA) Middleware, Operating Systems, Development and Modeling, Application
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Artesyn Expands Compliance Program to Include NEBS GR-63-CORE, Enabling Customers to Reduce Time-to-Market by More Than 40 Percent
Artesyn Embedded Technologies today announced it has expanded both its ISO/IEC 17025 American Association for Laboratory Accreditation (A2LA) and Verizon NEBS Testing Certification Witnessing Program (TCWP) scope to include GR-63-CORE.
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Gore and Amphenol Offer Superior Ethernet Interconnect Performance for Military and Civil Aircraft Applications
W. L. Gore & Associates, Inc. (Gore) and Amphenol Corporation recently launched high-speed interconnect offerings to deliver superior 10 Gigabit Ethernet (GbE) performance for military and civil aircraft applications.
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The road to achieving teraflop-scale computing in AdvancedTCA
The proposal: Develop a high-performance machine vision design for use in an industrialized environment, requiring overall high availability and reliability. The challenge: To develop a high-density imaging platform that could scale up to multiple 42U racks.
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GORE(r) Aerospace USB 3.1 Cables Meet Passenger Demand for Faster In-Flight Entertainment Content Uploads and Downloads
In response to advancements in modern airborne digital networks and passenger demand, W. L. Gore & Associates (Gore) introduces GORE(r) Aerospace USB 3.1 Cables.
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GORE(r) Aerospace HDMI 2.0 Cables Provide Higher Video Resolution for In-Flight Entertainment (IFE) within Civil Aerospace Applications
W. L. Gore & Associates (Gore) introduces GORE(r) Aerospace HDMI 2.0 Cables in response to advancements in modern airborne digital networks and passenger demand.
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Adding advanced server-management features to ATCA IPMCs
With substantial convergent forces pushing data center and network center functionality together, AdvancedTCA (ATCA) server blades can further strengthen their management credentials by adding advanced server-management facilities at the hardware platform management (HPM) level.
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GORE(r) Microwave/RF Assemblies Provide Superior Ka-Band Performance within Civil Aerospace Applications
W. L. Gore & Associates (Gore) presents GORE(r) Microwave/RF Assemblies, Type 5H optimized specifically for Ka-Band uplink and downlink aerospace applications.
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Embedded World 2016 show big for PICMG
The Embedded World Exhibition and Conference, which was held in February in Nuremberg, Germany, was a major meeting point for PICMG member companies and those who were looking for PICMG standards-based products and technologies.
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AbelConn Electronics receives a Rockwell Collins Platinum Premier Award
Out of numerous suppliers, 300 attended the Rockwell Supplier Conference on March 1st. They gave out (15) Platinum Premier Awards. The AbelConn Electronics division of Atrenne Integrated Solutions is pleased to among the winners.
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PICMG standards updates, improvements
Below are highlights from the current efforts of the PICMG technical community to update and improve a number of popular PICMG standards.
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Atrenne Integrated Solutions Announces Divestiture of Photo Etch
Atrenne Integrated Solutions(r) announced today that it has sold substantially all of the assets and liabilities of its Photo Etch division to Firan Technology Group Corporation. This move enables Atrenne to focus on its core business: integrated components, electronic packaging, fabricated metal components, complex electronic assemblies and value-add build-to-print manufacturing services to military and industrial markets across the globe.
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Datalight's New Reliance Nitro 4.0, A Power Failsafe, High Performance File System, Improves Support for SE Linux.
Reliance Nitro 4.0 Now Supports Linux Kernels 2.6.31 through 4.3, including Security Enhanced Linux
Artesyn Embedded Technologies
André van Herk, Prodrive Technologies
Atrenne Integrated Solutions, AbelConn Electronics Division
Atrenne Integrated Solutions