Embedded Software
Networking/Protocol, Management/High Availability (HA) Middleware, Operating Systems, Development and Modeling, Application
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High-energy physics: Controllers for X-ray laser accelerators
DESY (Deutsches Elektronen-Synchrotron) - one of the world's leading particle-accelerator centers, conducting top-level international research into the fundamental relationships of matter - was tasked with finding a successor technology for its control and data-acquisition systems, which were based on VME and proprietary hardware, some of which was more than 30 years old. The main requirements: better signal quality, higher bandwidth, and support for several decades of operation, allowing for a phased migration in current installations.
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Leveraging COM Express for medical equipment design
Modern-day medical applications have a wide spectrum of needs, from the demanding computing requirements of optical imaging technologies - such as magnetic resonance imaging (MRI), optical coherence tomography (OCT), X-ray computed tomography (CT), computed axial tomography (CAT) scans, and 3D ultrasounds - to the compact form factor and low power consumption necessary for mobile diagnostic equipment.
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MicroTCA workshop at DESY - 2018
The 7th MicroTCA Workshop for Industry and Research was held at DESY [Deutsches Elektronen-Synchrotron] in Hamburg, Germany on December 5 and 6, 2018. The workshop was attended by 190 participants from more than 20 research facilities and more than 30 ...
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Celebrating 25 years of PICMG
Welcome! PICMG is celebrating its 25th year with great momentum and many active committees. Since our founding, nine families of specifications and tens of thousands of successful collaborations have led to billions of dollars in products and solutions across a wide array of markets. We are poised to continue our efforts in solving embedded computing requirements through new and expanded open specifications.
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Next-generation backplane production technology
Next-generation data rates are placing higher demands on backplane design, assembly, and test. New production techniques are required to deal with these evolving data-rate realities.
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SU1-TWIST, Quad RS-485 CompactPCI Serial Card
HAMM, Germany. Proven and reliable, RS-485 (EIA/TIA-485) stays a popular fieldbus communication interface, due to simple installation via low cost twisted pair copper cables, up to 1200m length. EKF introduces the SU1-TWIST, a peripheral slot card for CompactPCI Serial systems, based on PCI Express. The board is equipped with four isolated front panel RS-485 ports. High speed RS-485 balanced line transceivers with internal 5kV isolation barrier provide for optimum noise and EMC immunity.
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SU2-BALLAD, Quad RS-232 CompactPCI Serial Card
HAMM, Germany. Proven and reliable, RS-232 stays a popular point-topoint interface for industrial communication (IOT, Edge Computing). EKF presents the SU2-BALLAD, a peripheral slot card for CompactPCI Serial systems, equipped with four front panel RS-232 ports. Isolation barrier transceivers are provided for optimum noise and EMC immunity up to 921.6kbps data rate, as required for industrial use and operation in harsh environments.
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CompactPCI Serial CPU with Intel Apollo Lake Processor
HAMM, Germany. On the occasion of the Embedded World Exhibition & Conference EKF will introduce the SC6-TANGO, a low power CompactPCI Serial CPU board, based on an Intel Atom E39xxseries System-on-Chip processor (Apollo Lake APL-I). The front panel is provided with two Gigabit Ethernet jacks (option M12 X-coded), two USB 3.0 Type-A receptacles, and two DisplayPort monitor connectors. The board is equipped with 8GB directly soldered DDR3L ECC RAM, and a CFast card socket, for use as removable SATA SSD.
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VadaTech Announces New Zynq UltraScale+ RFSoC FPGA, Double AMC, MTCA.4
HENDERSON, Nev. VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC575. The AMC575 utilizes the Xilinx XCZU29DR RFSoC and is compliant to AMC.1, AMC.2, AMC.3 and AMC.4 specifications. The unit has an on-board, re-configurable FPGA which interfaces directly to the AMC FCLKA, TCLKA-D. The module has dual bank of 64-bit wide DDR-4 memory with ECC for a total of 16 GB. This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
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Collaboration enables innovation
"In the long history of humankind (and animal kind, too) those who learned to collaborate and improvise most effectively have prevailed." - Charles Darwin
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Bringing IoT to the sensor domain: Sensors Expo recap
Sensors Expo was held in San Jose from June 26 to 28, 2018. It was great to see a trade show with growing attendance and enthusiasm. Regardless of the type of sensor vendor on display, the trend to connect sensor technologies was widespread. Featured were wireless innovations, an embedded system area, a university showcase, and even clever end solutions such as the sensor-laden mattress, which we all admired longingly after being on our feet all day.
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Tackling the challenges of industrial IoT
The Internet of Things (IoT) promises to transform the way that we deploy industrial applications by combining the best practices from the IT space with cloud-based analytics and machine learning.
EKF Elektronik GmbH
