Webinar Series on Electronics Thermal Management Offered by Advanced Thermal Solutions

Advanced Thermal Solutions, Inc. (ATS) has announced the schedule for its year-long series of thermal management webinars; online technical presentations for all engineers, designers and program managers with an interest in electronics cooling.

Norwood, MA, February 10, 2009 – Advanced Thermal Solutions, Inc. (ATS) has announced the schedule for its year-long series of thermal management webinars; online technical presentations for all engineers, designers and program managers with an interest in electronics cooling. The 2009 Thermal Management Webinar Series features tutorials which provide practical information on critical areas of thermal management to help optimize individual cooling solutions.

Each of the approximately one-hour tutorials will include detailed visuals and real time narration by an ATS thermal management expert. Viewers will be able to key in questions during and after the presentation.

Each webinar in this series will focus on a different topic in the critical arena of electronics thermal management. Tutorial topics include:

February 26, 2009 at 2:00 p.m. (EST): “Electronics Cooling Options” The market is saturated with varied cooling options for thermal management of electronic systems. Oftentimes, selecting the right cooling solution is a daunting task for engineers who are not actively involved in thermal management. In this webinar, cooling options and their salient features are reviewed, providing the practicing engineer with a strong overview of what has been done and what the limitations of such options are.

March 26, 2009 at 2:00 p.m. (EDT): “Tools and Methods for Temperature Measurement within Electronic Systems” Attendees will learn the importance of temperature measurement in electronic systems, the instruments that are necessary and locations within a systems where testing should be conducted.

April 30, 2009 at 2:00 p.m. (EDT): “Tools and Methods for Air Velocity Measurement within Electronics Systems” Participants will learn about the importance of measuring air velocity in a system, the instruments necessary for obtaining useful measurements and where these velocities should be recorded.

May 28, 2009 at 2:00 p.m. (EDT): “Heat Sink Selection Made Easy” As heat dissipation needs for electronic devices grow rapidly, choosing the right heat sink the first time is essential. With so many application requirements and heat sink options, this can be a daunting task. In this webinar, attendees will learn about the importance of system airflow and its impact on heat sink design; attachment methods and how to solve design challenges thermally and mechanically; and how to make the right custom or off-the-shelf heat sink choice for your application and budget.

June 25, 2009 at 2:00 p.m. (EDT): “Analytical, Computational and Experimental Thermal Analysis of an ATCA Chassis” ATCA chassis are becoming increasingly dense with more powerful components. The junction temperatures of those components often determine the fate of a product. Products designed with the most components and adequate cooling, in the quickest time-to-market, are often the most successful. Analytical, Computational and Experimental Thermal Analysis of an ATCA Chassis will provide design engineers with advanced, fast and accurate thermal design techniques that will help them efficiently use modeling and testing tools to determine device junction temperatures and speed time-to-market.

July 30, 2009 at 2:00 p.m. (EDT): “Heat Sink and System Modeling Using CFD” Computational Fluid Dynamics (CFD) tools have become simulation workhorses, enabling design engineers to tackle electronics cooling challenges on-the-fly. Some tips and tricks are invaluable in performing these analyses. Among them: the simplest methods of preparing a CFD model; the best techniques for meshing; and how to model a system’s components, such as fans and perforated plates. Attendees will learn about common and not-so-common issues in CFD, and how to overcome them.

August 27, 2009 at 2:00 p.m. (EDT): “Methodologies for Fan Characterization and Deployment within a System” Exponential increases in power dissipation are forcing engineers to rely more on fans as the solution to their thermal challenges. But fans are also common points of failure within a system. As the choice and use of fans become critical to system functionality, knowledge of fan characterization is essential. Participants will be provided with solid methodologies for characterizing fans and deploying them within a system.

September 24, 2009 at 2:00 p.m. (EDT): “Selecting and Implementing Liquid Cooling within Electronic Systems” The use of liquid cooling systems is becoming more practical and effective for managing skyrocketing increases in power dissipation. But how do you decide when you need to cool with liquid? How do you find the right liquid cooling system for your application? This webinar provides the best practices for implementing a liquid cooling system.

October 29, 2009 at 11: 00 a.m. (EDT): “LED Thermal Management in Commercial and Consumer Lighting Applications” Why does thermal management matter? Excess heat directly affects both short-term and long-term LED performance. The short-term effects are color shift and reduced light output while the long-term effect is accelerated lumen depreciation and thus shortened useful life. Participants will learn how to diagnose and solve thermal issues in consumer and commercial LED applications.

November 19, 2009 at 2:00 p.m. (EST): “Using Thermal Interface Materials to Improve Heat Sink Thermal Performance” To cool hotter components, engineers are turning to larger fans and heat sinks and added surface area. But these hardware changes add significant cost to the design. Alternatively, a cooling system’s performance can be improved just by using a better interface material to lower thermal resistance at the interface of the case and the heat sink. Participants will learn to overcome thermal challenges by making simple and cost-effective changes in thermal interface materials.

December 3, 2009 at 2:00 p.m. (EST): “Basics and Options in Thermal Modeling and Analysis of Electronic Systems” Modeling and simulations are the cornerstone of any successful product launch in electronics products. Engineers are faced with three modeling options, Analytical, Computational and Experimental. In this tutorial, these modeling options are reviewed and their application to a problem domain is discussed.

More information about the ATS Thermal Management Webinar Series, including course descriptions, schedules and how-to registration instructions can be found on the Advanced Thermal Solutions website, www.qats.com, or by calling 1-781-769-2800.

About Advanced Thermal Solutions

Advanced Thermal Solutions is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides a wide range of air and liquid cooling solutions, laboratory-quality thermal instrumentation, along with thermal design consulting services and training. For more information about Advanced Thermal Solutions, Inc., please visit www.qats.com or call 781-769- 2800.