Radisys to Demonstrate Next-Generation Embedded Computing Solutions at Embedded World

embedded world Conference 2010

HILLSBORO, Ore.--Radisys® Corporation (NASDAQ: RSYS), a leading global provider of application-ready software and hardware platforms, today announced it will demonstrate its industry-leading COM Express modules and AdvancedTCA platforms for mil/aero, medical, industrial and communications applications at Embedded World, March 2-4, in Nuremberg, Germany.


March 2-4, 2010


Embedded World 2010, Nuremberg, Germany

IFTEST Booth #9-244

Intel Corporation Booth #9-163

MicroSys Booth #12-214

Nolam Embedded Systems Booth #9-144

Systerra Booth #9-235


Radisys will showcase its Procelerant™ COM Express modules and Promentum® ATCA solutions.

To meet with Radisys at Embedded World, contact info@Radisys.com.

Radisys (NASDAQ: RSYS) is a leading global provider of application ready-software and hardware platforms for use in the communications, multi-media, mil/aero and medical markets. Radisys’ innovative and market-leading technologies help equipment manufacturers and network operators bring the most advanced products and services to market faster and more economically. For more information, visit www.Radisys.com, write to info@Radisys.com, or call 800-950-0044 or 503-615-1100. Editors seeking more information may contact Lyn Pangares at Radisys Corporation at 503-615-1220 or lyn.pangares@Radisys.com.