Kontron next-generation COBALT delivers application-specific I/O ideally suited to established military application profiles

New I/O options are cost-effective, modular solutions that streamline integration of situational awareness, removable storage and processor/networking switch capabilities

Washington, DC – Kontron, a leading global provider of Embedded Computer Technology (ECT), today announced at the 2014 AUSA Annual Meeting and Exposition the availability of new I/O options with its next-generation Kontron high-performance embedded computer COBALT (Computer Brick Alternative) system to help reduce development costs and streamline the time to deployment. The new I/O options are offered via COBALT’s advanced tightly-coupled mezzanine features, a ruggedized compact carrier board and System Interface Board (SIB). These basic modular and standards-based platform profiles match established development requirements for situational awareness, removable storage and combination processor/networking switch capabilities applicable to a wide range of ground, ship, avionics and unmanned military systems. The latest Kontron COBALT I/O options will be demonstrated at the Kontron AUSA booth #3543 at the Walter E. Washington Convention Center in Washington DC, October 13-16, 2014.

Facilitating development, COBALT features a configurable front panel for modular I/O profile options. Enhanced I/O is achieved through 1x XMC slot, 2x mPCIe full slot or 1x mPCIe full and 2x mPCIe half. These profile slots and front I/O panel allow full support for different profile options such as ARINC 429, MIL-STD-1553, combined L2/L3 GbE switch/processor, CANbus, Wi-Fi, WiMAX, 3G/4G modem, GPS, additional Serial Ports, FPGA, A/D and more.

The Kontron COBALT family in detail

The next-generation Kontron COBALT family offers a complete, rugged small form factor system. Ideal for the harshest environment operational demands of applications in many industries, Kontron designed the COBALT’s IP67 chassis to operate reliably in a multitude of conditions including extreme temperatures, shock, vibration and EMI. Powering the Kontron COBALT base system is a 3rd generation Intel® dual core-based COM Express® Type 6 module that features ECC, rapid shutdown design and 100% extended temperature screening with the option of removable or fixed SSDs and/or fixed mSATA storage. Windows, Linux and VxWorks operating system and software support packages are also available. Meeting the military’s Size, Weight and Power (SWaP) requirements, the Kontron COBALT provides a low profile, fanless and fully enclosed system that provides efficient thermal management in a small 5.5 x 8.5 x 3.9-inch (140 x 216 x 99 mm) form factor weighing less than 6 pounds (2.7 kg). Furthermore, the carrier board design maximizes the system’s capabilities while minimizing its overall size and ensures reliable operation in higher temperature and shock and vibration conditions. COBALT is designed based on specifically-selected components from embedded roadmaps enabling Kontron to ensure long-term availability and minimizing the risk of unplanned design changes and unexpected application modification.

The Kontron COBALT and the identified I/O options are available without ITAR restrictions. Kontron will continue to release application-specific profiles of its next-generation COBALT platform, and can readily support custom configured solutions as well. For more information, please visit the Kontron COBALT product page.

About Kontron

Kontron is a global leader in embedded computing technology. With more than 44% of its employees in research and development, Kontron creates many of the standards that drive the world’s embedded computing platforms. Kontron’s product longevity, local engineering and support, and value-added services, help create a sustainable and viable embedded solution for OEMs and system integrators. Kontron works closely with its customers on their embedded application-ready platforms and custom solutions, enabling them to focus on their core competencies. The result is an accelerated time-to-market, reduced total-cost-of-ownership and an improved overall application with leading-edge, highly-reliable embedded technology.