Flexible, modular Skylake PICMG 1.3 CPU card from ICP Deutschland
The new Skylake PICMG 1.3 CPU card from ICP Deutschland and various backplane variants from a flexible modular system for the development of expandable and compact industrial PC for system control and image processing.
|PCIE-Q170 – Skylake PICMG 1.3 CPU Card|
For system integrators and developers is the expandability of industrial PC essential. A particularly flexible solution is the combination of CPU card and backplane. In contrary to mainboards, this technology has the advantage that it is modularly built and compatible to various customer specific applications. In the product range of ICP Deutschland are about 50 backplanes and 20 CPU cards with PICMG 1.3 and 1.0 standard available for selection. Among them is one recent representative - the PCIE-Q170 CPU card. It can be equipped with a high-performance Intel® 6th generation Core™ i7/i5/i3, Pentium® or Celeron® processor and max. 64GB DDR4 SDRAM. Thus, in combination with an additional backplane up to 20 slots can be used for expansions. Visual expandable is the CPU card via one VGA and one internal Display Port (iDP) that allow the actuation of two independent displays. Different converter boards convert the iDP to DP, DVI-D, HDMI, LVDS or VGA. Furthermore, two RS-232/422 and RS-232/422/485 each as well as one parallel interface (LPT) complete the functional range of the PCIE-Q170. These interfaces have proved its worth in the industrial context, e.g. for the communication with different input devices, over the years. One on-board integrated TPM module (1.2 and 2.0) and different RAID Modi (1/2/5/10) secure the hardware additionally. The former encrypts the transfer of critical data; the latter ensures drive redundancy via six SATA 6Gb/s ports. ICP delivers this flexible modular system, consisting of PCIE-Q170 and a compatible backplane, as Ready-to-Use system.