Advanced Thermal Solutions, Inc. to Present on Next-Generation Cooling at the AdvancedTCA Summit

Norwood, MA, October 8, 2008 – Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today announced that Dr. Kaveh Azar, the company’s president and CEO, an expert in electronics cooling, will present at the AdvancedTCA Summit on Tuesday, October 21, 2008 from 8:30 a.m. to 12:00 p.m. EDT. The AdvancedTCA Summit is scheduled for October 21 through 23 at the Santa Clara Convention Center in Santa Clara, California.

Norwood, MA, October 8, 2008 – Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today announced that Dr. Kaveh Azar, the company's president and CEO, an expert in electronics cooling, will present at the AdvancedTCA Summit on Tuesday, October 21, 2008 from 8:30 a.m. to 12:00 p.m. EDT. The AdvancedTCA Summit is scheduled for October 21 through 23 at the Santa Clara Convention Center in Santa Clara, California.

Dr. Azars presentation during the Forum F1B: Next Generation Cooling session will focus on how to develop ATCA systems that deliver increased performance, greater thermal stability, reduced operating costs, easy network adoption, all while meeting the greater cooling requirements. His presentation will also take an in depth look at how long designers will be able to rely on air cooling and the implications on electrical and packaging design.

Kaveh Azar will also be joined by a distinguished panel of experts on ATCA architecture and thermal management for a discussion of some of the key issues that will affect ATCA thermal design in the future. Next-Generation Cooling panelists include: Charles C. Byers, Technical Leader and Platform Architect, Digital Media Systems Business Unit, Cisco Systems; Marc Caiola, Market Segment Manager, Pentair Electronic Packaging; Dr. Jim Clink, Director of Research & Development, Simclar Group; Steve Hauser, Chief Architect, Emerson Network Power; Michael Palis, Senior Thermal Engineer, Hybricon Corporation; Bob Pipkin, Director, AT&T NEBS; and Majid Safavi, Distinguished Member of Technical Staff, Alcatel-Lucent.

Also featured during the program session will be a live demonstration of tools, techniques and best practices for ATCA thermal analysis and characterization. Attendees will learn how to pinpoint potential thermal challenges simply and quickly in order to speed up design and qualification of their systems.

For more information or to register for the AdvancedTCA Summit and the Forum F1B: Next Generation Cooling session, please visit www.advancedtcasummit.com.

About Advanced Thermal Solutions, Inc.

Advanced Thermal Solutions is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides a wide range of air and liquid cooling solutions, laboratory-quality thermal instrumentation, along with thermal design consulting services and training. For more information about Advanced Thermal Solutions, Inc., please visit www.qats.com or call 781-769- 2800.

About the AdvancedTCA Summit

The AdvancedTCA Summit is the only conference dedicated entirely to this emerging standard platform for telecommunications. The Summit features tutorials, workshops, paper and panel sessions, keynotes, and exhibits. Subjects include hardware, software, design methods, applications, standards, interfaces, design methods, and market research. It also covers related standards such as AdvancedMC, MicroTCA, and ATCA300. AdvancedTCA Summit is produced in cooperation with such organizations as PICMG (PCI Industrial Computer Manufacturers Group), CP-TA (Communications Platforms Trade Association), SCOPE (network equipment providers), SAF (Service Availability Forum), and the Ethernet Alliance. For more information, visit www.advancedtcasummit.com.