Radisys Expands Its AdvancedTCA Solutions with Additional Product Offerings and Partner Program
HILLSBORO, Oreg. — October 20, 2004 — Today, Radisys Corp. (Nasdaq: RSYS), a leading supplier of advanced embedded systems, underscored its commitment to the AdvancedTCA® (Advanced Telecom Computing Architecture) market with its expanded Promentum™ family of AdvancedTCA-compliant products and new alliance partner program. The company's AdvancedTCA strategy is based on its success as a strategic supplier of proven, tested, modular platforms that help TEMs (Telecom Equipment Manufacturers) reduce costs and development time associated with designing next generation communications equipment.
The AdvancedTCA standard defines a common platform architecture, enabling deployment of flexible solutions that capitalize on reusable designs and commercially available components for significant savings in development time and investment. As a Premier member of the Intel® Communications Alliance (ICA), PICMG (PCI Industrial Computer Manufacturers Group) and the SAForum, Radisys has played a leading role it the development and adoption of standards, including AdvancedTCA.
Radisys' announcement marks a continued expansion of its strategy to:
• Deliver products to TEMs that include a family of carrier grade, integrated blade servers and network element platforms that together address control plane and data plane applications. The Radisys integrated platforms make extensive use of common architectural and component designs, and integrates carrier grade operating systems and middleware, reducing development costs and enhancing application portability.
• Broaden the solution scope by building a robust ecosystem of partners through the Radisys Alliance Program (RAP), composed of companies which provide technology solutions and services that enhance Radisys' AdvancedTCA products. By working closely with an ecosystem of component and solution providers through RAP, Radisys will enable TEM customers to bring more integrated applications to market faster.
These expansions of its AdvancedTCA offering combined with the company's distinguished history as a strategic TEMs supplier, unequaled system engineering and system integration expertise, ability to manage supply chain and full lifecycle functions for customers and worldwide support capabilities positions Radisys as a leader in delivering platform solutions that meet the growing demands of TEMs.
Radisys' strategy is to deliver fully-integrated, application-ready AdvancedTCA platforms, allowing TEM customers to focus on attributes of their systems that differentiate their products. Radisys believes this strategy enables its customers to leverage and multiply the impact of internal development efforts while introducing platforms faster, with reduced investment. Combining industry leading hardware, software and services with Radisys' unique value provides TEMs with AdvancedTCA platforms that can reduce product development time by as much as 50 percent.
"AdvancedTCA is gaining momentum and acceptance and we are committed to delivering a broad range of market-leading solutions for our customers, both internally developed and through our Radisys Alliance Program," said Scott Grout, Radisys president and CEO. "Our strategy goes beyond developing AdvancedTCA building blocks and is designed to deliver a comprehensive portfolio of integrated platform solutions that meet our customers' current and future needs. We have a rich history of providing OEMs with solutions that help them develop better products faster and more economically and will continue this performance in AdvancedTCA."
"We believe deployment of modular platforms based on Intel® processors will continue to grow as carriers look for ways to reduce operating costs and time-to-revenue," said Howard Bubb, vice president and general manager of Intel's Communications Infrastructure Group. "Radisys' strategy centered around integrating modular, standards based platforms for next generation communications equipment can have a significant impact on time to market."
Radisys Promentum™ Family
The Radisys Promentum family is a suite of carrier grade platforms addressing blade server and network element applications designed to offer industry leading price/performance and unparalleled flexibility. Radisys delivers Promentum systems, consisting of Radisys and third party components that are validated through proven hardware and software validation procedures. The Radisys validation program is based on Radisys' system engineering and integration experience, and provides a complete functional, parametric and limit testing for turn-key platforms. Validation of platforms at these levels means customers can confidently and quickly deploy Promentum solutions in their networking systems. The Promentum™ SYS-6000 is an application-ready, highly configurable, integrated Linux blade server for control and services plane applications. These common platforms help TEMs reduce costs, shorten development time and realize economies of scale, and flexibility, from platform application reuse.
The Radisys Promentum SYS-6000 will be available in January 2005. The Radisys Promentum™ ATCA-1000, the industry's first AdvancedTCA universal PMC processing module was announced in June, 2004.
Radisys Alliance Program
RAP will expand the scope of integrated solutions through collaborative relationships between Radisys and its partners. In particular, the program will enable TEMs to access and deploy Radisys platforms with integrated and validated third party components quickly and cost-effectively. RAP is composed of industry leading technology companies that provide market-ready solutions that complement Radisys' AdvancedTCA products.
Partners currently include Clovis Solutions (system management and high-availability middleware), GoAhead Software (high-availability middleware solutions), Hughes Software (SS7, SIP server and 3G UMTS software solutions), IPFabrics (IXP programming tools), LVL7 Systems, Inc. (production-ready networking software), MontaVista Software (carrier grade Linux operating system software, tools and support), Solid Information Technology (carrier-grade distributed data management platform), Teja Technologies (IXP programming platform), Ulticom (service-enabling signaling software) and Wind River Systems (operating system software, tools and support).
Radisys (Nasdaq: RSYS) is the leading provider of advanced embedded solutions for the commercial, enterprise, and service provider systems markets. Through intimate customer collaboration, and combining innovative technologies and industry leading architecture, Radisys helps OEMs bring better products to market faster and more economically. Radisys products include embedded boards, platforms and systems, which are used in today's complex computing, processing and network intensive applications.
Radisys is a premier member of the Intel® Communications Alliance (ICA). The Intel Communications Alliance is a member-based program comprised of communications and embedded developers and solution providers. Members are committed to providing a strategic supply of standards-based solutions to the communications and embedded market segments. For more information, please visit: www.intel.com/go/ica
Promentum is a trademark and Radisys a registered trademark of Radisys. All other products are trademarks or registered trademarks of their respective companies.
For more information, contact Radisys at info@Radisys.com or www.Radisys.com or call 800-950-0044 or 503-615-1100. For press information only: Lyn Pangares, Radisys Corporation, 503-615-1220.
Source: Radisys Corporation