EnSilica
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EnSilica boosts SoC design and supply services with two senior-level appointments
EnSilica has announced two senior-level appointments designed to significantly boost its rapidly expanding full System-on-Chip (SoC) services as the company continues to expand its base of customers seeking complex, full-service custom analog and mixed-signal chip design and supply. EnSilica has appointed David Tester to the newly created position of Director of SoC Architecture and Patrick McNamee to the newly created position of Director of Silicon Operations.
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EnSilica and Solomon Systech in multi-year eSi-RISC licensing deal
Multi-year licensing agreement for EnSilica's highly-configurable, high-performance, low-power eSi-RISC processor IP covers multiple projects and architectures
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EnSilica to provide BaySand's ASIC UltraShuttle-65 multi-project wafer customers with configurable eSi-IP solutions
EnSilica to provide BaySand's customers with configurable eSi-RISC processor cores, eSi-Connect processor peripherals, eSi-Crypto encryption and eSi-Comms communications IP solutions as well hardware accelerators
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EnSilica teams with BaySand to provide ASIC UltraShuttle-65 multi-project wafer customers with configurable IP solutions
EnSilica to provide BaySand's customers with configurable eSi-RISC processor cores, eSi-Connect processor peripherals, eSi-Crypto encryption and eSi-Comms communications IP solutions as well hardware accelerators
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EnSilica ports Micrium's µC/OS-III RTOS to eSi-RISC processor cores
EnSilica and Micrium have partnered to successfully port Micrium's µC/OS-III(r) RTOS to EnSilica's family of eSi-RISC processor cores. Micrium's µC/OS-III is available on eSi-RISC with immediate effect.
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EnSilica ports Micrium's µC/OS-III RTOS to eSi-RISC processor cores
EnSilica and Micrium have partnered to successfully port Micrium's µC/OS-III RTOS to EnSilica's family of eSi-RISC processor cores. Micrium's µC/OS-III is available on eSi-RISC with immediate effect.
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EnSilica launches eSi-ECDSA cryptographic IP for standards-compliant automotive Car2x communications
EnSilica has launched the eSi-ECDSA cryptographic IP designed to help meet the high security communication and latency requirements of automotive Car2Car and Car2Infrastructure (Car2x) applications that form part of today's emerging Intelligent Transport Systems.
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EnSilica and Express Logic collaborate to bring popular ThreadX RTOS to eSi-RISC processor cores
EnSilica and Express Logic have collaborated to port Express Logic's popular ThreadX real-time operating system (RTOS) to EnSilica's eSi-RISC family of silicon-proven, highly configurable embedded processor cores. The combination of eSi-RISC and ThreadX is ideally suited to IoT applications.
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EnSilica appoints Anglia Components as business development partner for eSi-Modules
EnSilica appoints Anglia Components as business development partner for eSi-Modules. Anglia will target the eSi-Modules at key vertical industry sectors including utilities, smart cities, oil and gas, access control, medical devices, IoT, industrial internet and telematics.
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DAC 2012: Posedge standardizes on EnSilica's eSi-3250 processor for wired/wireless networking IP solutions
Includes innovative new 12-core Wireless Packet Processor solution for application-aware WLAN access points and LTE basestations
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Xtendwave selects EnSilica's eSi-3200 processor for the receiver IC implementing NIST's next-generation WWVB atomic timekeeping signal
EnSilica has announced that Xtendwave has licensed its high-performance eSi-3200 32-bit processor core to power Everset(tm), Xtendwave's time code receiver solution for the next-generation WWVB atomic timekeeping signal. The new signal, broadcast by NIST (the National Institute of Standards and Technology), a US Government agency, will represent the official time of the USA and includes the implementation of daylight saving time and leap seconds.
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EnSilica and Evatronix collaborate on USB connectivity for eSi-RISC processors
EnSilica/Evatronix collaboration delivers fully featured eSi-RISC processor sub-systems with USB 1.1, 2.0 and 3.0 connectivity
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