COM Express
Filter: by Brandon Lewis, Technology EditorSee All
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Seeking a unified hardware approach for IIoT control
Although the Internet of Things (IoT) has emerged in every market segment, its implementation varies widely. In the Industrial IoT (IIoT), for example, a much more robust, reliable set of technologies is required than in the consumer world. Here, technology standards organizations will play an important role in ensuring that safety-critical IIoT systems can be developed at the lowest cost, fastest time to market, and minimize the low-level software engineering burden.
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On the loss of Joe Pavlat, a friend and mentor
My first day of work in the embedded computing space came the day after the Super Bowl in 2011. I had about as much knowledge of the high-tech industry as your casual commuter who catches a news snippet on one of the big five tech companies while buying their morning coffee, and frankly didn’t think [...]
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xTCA ecosystem reacts to technology, market shifts while COM Express emerges as SFF workhorse
In the fast-paced world of communications, technologies such as software-defined networking (SDN) and network functions virtualization (NFV) are ushering in a new networking paradigm. As these software-based solutions begin to take hold, the hardware architectures that will support them are jockeying for market share, with mixed projections for AdvancedTCA (ATCA) and MicroTCA (mTCA) growth over the next five years. Meanwhile, COM Express continues to surge in the ever-growing small form factor (SFF) market.
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COM Express: Scalability and flexibility for UAS sensor processing
Unmanned Aerial System (UAS) sensors are increasing in number and complexity, burying operators and analysts beneath more data than they can handle. In response, UAS engineers need to pack more processing power behind the sensor itself, and Commercial Off-The-Shelf (COTS) vendors are leveraging the low Size, Weight, and Power (SWaP) and flexibility of COM Express to meet their scalability demands.
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Portwell releases COM Express Type 10 “Nano” module
FREMONT, CA. The PCOM-B21A, a Type 10 COM Express module was released yesterday by American Portwell Technology, Inc. Equipped with a dual-core Intel Atom N2800/2600 processor and measuring 84 mm x 55 mm, the module supports operating temperatures from -40ºC to +80ºC.
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COM Express subcommittee talks R2.1
Revision 2.1 of the PICMG COM Express specification was adopted this May, so CompactPCI, AdvancedTCA & MicroTCA Systems sat down with key members of the subcommittee for a closer look at COM Express.
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AAEON introduces COM-CV Rev.B Type 6 COM Express board
COM-CV Rev.B from AAEON is a Type 6 COM Express module buily on 32 nm process technology and featuring dual-core Intel Atom D2550 or N2600 processors at a low 3.5 W. The COM, which also includes Intel’s NM20 Express chipset and 82583V GbE controller, supports H.264 video decoding and a 24-bit LVDS LCD interface for connecting to graphics-intensive displays
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congatec COM Express Type 2 module with 3rd generation Intel Core processor
The conga-BP77 3rd generation Intel Core modules based on the COM Express Type 2 connector pinout has been released by congatec. Supporting a PCI Express Graphics (PEG) 3.0 port capable of 8 GTps and the Intel Core’s 22 nm, 3D trigate transistor technology, the conga-BP77 is ideal for applications demanding high-end graphics performance. As the PEG connection is established on a custom carrier board, by leveraging the conga-CEVAL evaluation carrier board with the conga-BP77 proprietary solutions can be easily developed.
Brandon Lewis, Technology Editor