MicroTCA and the Advanced Mezzanine Card (AMC)

The “Higher Speed Ethernet Fabrics for MicroTCA.0 and AMC.1” group is working on bringing 40 GbE to MicroTCA systems. The committee is currently working on completing signal-integrity studies across the full interconnect channel. S-parameter models for the backplane and AMC have been developed and simulated; work on the MCH is being completed. Combinations of 90 and 110 ohm impedance signal pairs are being simulated in order to see the behavior of all corner cases. The committee will then compare the channel simulations with IEEE 40GBASE-KR4 requirements.

A 40 G test backplane has already been designed and simulated, as has the AMC probe card. The MicroTCA carrier hub (MCH) probe card is also nearly complete. In the coming months, it is expected that all the simulations and characterizations will be complete. From there, the MicroTCA.0 and AMC.1 specifications will be updated with the results, including the CRs (Change Requests) that have already been addressed. These documents will then be submitted to the broader membership for review and approval.

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